Discover the critical role of PCB materials in 5G system design. Learn how dielectric properties, thermal management, and material selection impact signal integrity. Includes detailed comparison tables of amplifier, antenna, and high-speed module PCB substrates.
Introduction
The arrival of 5G technology has transformed wireless communication, requiring electronic systems to operate at higher frequencies and faster data rates than ever before. At the heart of this transformation lies PCB materials—the foundation of 5G circuits. Selecting the right substrate is essential to ensuring low signal loss, stable thermal performance, and reliable high-frequency transmission.
This article explores the critical material properties for 5G PCB design and provides comprehensive reference tables for amplifier, antenna, and high-speed module substrates widely used in the industry.
Why PCB Materials Matter in 5G Design
Unlike traditional circuits, 5G systems combine high-speed digital and high-frequency RF signals, making them highly susceptible to electromagnetic interference (EMI). Material selection directly impacts signal integrity, dielectric stability, and heat dissipation.
Key factors to consider include:
- Dielectric Constant (Dk): Lower Dk materials reduce signal delay and dispersion.
- Dissipation Factor (Df): A low Df minimizes energy loss, crucial for GHz-level frequencies.
- Thermal Conductivity: Effective heat dissipation ensures stable system performance.
- Thermal Coefficient of Dielectric Constant (TCDk): Prevents dielectric property shifts under temperature changes.
Best Practices in 5G PCB Design
- Impedance Control: Maintain consistent trace impedance across interconnects.
- Short Signal Paths: RF traces should be as short as possible.
- Precise Conductor Geometry: Trace width and spacing must be tightly controlled.
- Material Matching: Use substrates optimized for their intended function (amplifier, antenna, or module).
5G PCB Material Reference Tables
1. 5G Amplifier PCB Materials
| Material Brand |
Type |
Thickness (mm) |
Panel Size |
Origin |
Dk |
Df |
Composition |
| Rogers |
R03003 |
0.127–1.524 |
12”×18”, 18”×24” |
Suzhou, China |
3.00 |
0.0012 |
PTFE + Ceramic |
| Rogers |
R04350 |
0.168–1.524 |
12”×18”, 18”×24” |
Suzhou, China |
3.48 |
0.0037 |
Hydrocarbon + Ceramic |
| Panasonic |
R5575 |
0.102–0.762 |
48”×36”, 48”×42” |
Guangzhou, China |
3.6 |
0.0048 |
PPO |
| FSD |
888T |
0.508–0.762 |
48”×36” |
Suzhou, China |
3.48 |
0.0020 |
Nanoceramic |
| Sytech |
Mmwave77 |
0.127–0.762 |
36”×48” |
Dongguan, China |
3.57 |
0.0036 |
PTFE |
| TUC |
Tu-1300E |
0.508–1.524 |
36”×48”, 42”×48” |
Suzhou, China |
3.06 |
0.0027 |
Hydrocarbon |
| Ventec |
VT-870 L300 |
0.08–1.524 |
48”×36”, 48”×42” |
Suzhou, China |
3.00 |
0.0027 |
Hydrocarbon |
| Ventec |
VT-870 H348 |
0.08–1.524 |
48”×36”, 48”×42” |
Suzhou, China |
3.48 |
0.0037 |
Hydrocarbon |
| Rogers |
4730JXR |
0.034–0.780 |
36”×48”, 42”×48” |
Suzhou, China |
3.00 |
0.0027 |
Hydrocarbon + Ceramic |
| Rogers |
4730G3 |
0.145–1.524 |
12”×18”, 42”×48” |
Suzhou, China |
3.00 |
0.0029 |
Hydrocarbon + Ceramic |
2. 5G Antenna PCB Materials
| Material Brand |
Type |
Thickness (mm) |
Panel Size |
Origin |
Dk |
Df |
Composition |
| Panasonic |
R5575 |
0.102–0.762 |
48”×36”, 48”×42” |
Guangzhou, China |
3.6 |
0.0048 |
PPO |
| FSD |
888T |
0.508–0.762 |
48”×36” |
Suzhou, China |
3.48 |
0.0020 |
Nanoceramic |
| Sytech |
Mmwave500 |
0.203–1.524 |
36”×48”, 42”×48” |
Dongguan, China |
3.00 |
0.0031 |
PPO |
| TUC |
TU-1300N |
0.508–1.524 |
36”×48”, 42”×48” |
Taiwan, China |
3.15 |
0.0021 |
Hydrocarbon |
| Ventec |
VT-870 L300 |
0.508–1.524 |
48”×36”, 48”×42” |
Suzhou, China |
3.00 |
0.0027 |
Hydrocarbon |
| Ventec |
VT-870 L330 |
0.508–1.524 |
48”×42” |
Suzhou, China |
3.30 |
0.0025 |
Hydrocarbon |
| Ventec |
VT-870 H348 |
0.08–1.524 |
48”×36”, 48”×42” |
Suzhou, China |
3.48 |
0.0037 |
Hydrocarbon |
3. 5G High-Speed Module PCB Materials
| Material Brand |
Type |
Thickness (mm) |
Panel Size |
Origin |
Dk |
Df |
Composition |
| Rogers |
4835T |
0.064–0.101 |
12”×18”, 18”×24” |
Suzhou, China |
3.33 |
0.0030 |
Hydrocarbon + Ceramic |
| Panasonic |
R5575G |
0.05–0.75 |
48”×36”, 48”×42” |
Guangzhou, China |
3.6 |
0.0040 |
PPO |
| Panasonic |
R5585GN |
0.05–0.75 |
48”×36”, 48”×42” |
Guangzhou, China |
3.95 |
0.0020 |
PPO |
| Panasonic |
R5375N |
0.05–0.75 |
48”×36”, 48”×42” |
Guangzhou, China |
3.35 |
0.0027 |
PPO |
| FSD |
888T |
0.508–0.762 |
48”×36” |
Suzhou, China |
3.48 |
0.0020 |
Nanoceramic |
| Sytech |
S6 |
0.05–2.0 |
48”×36”, 48”×40” |
Dongguan, China |
3.58 |
0.0036 |
Hydrocarbon |
| Sytech |
S6N |
0.05–2.0 |
48”×36”, 48”×42” |
Dongguan, China |
3.25 |
0.0024 |
Hydrocarbon |
Conclusion
The transition to 5G networks demands more than just faster processors and advanced antennas—it requires optimized PCB materials tailored to specific system functions. Whether in amplifiers, antennas, or high-speed modules, low-loss, thermally stable substrates are the foundation of reliable 5G performance.
By carefully selecting materials based on Dk, Df, and thermal properties, engineers can build circuit boards that ensure robust, high-frequency, and high-speed performance—meeting the demands of next-generation wireless communication.
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